12 layer blind & buried hole heavy copper board

Our services cover conventional pcbs and high density multilayer boards; we offer quick-turn around and standard lead time no matter it is rigid or fpc or rigid-flex.
Description
Item Capability parameters
Layer count 1 ~ 64layers
Laminates type FR-4(High Tg, Halogen Free, High Frequency)
FR-5, CEM-3, PTFE, BT, Getek, Aluminium baseCopper baseKB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon
Board thickness 6-240mil
Max Base copper weight 210um (6oz) for inner layer 210um (6oz) for outer layer
Min mechanical drill size 0.2mm (0.008")
Aspect ratio 12 : 1
Max panel size Sigle side or double sides:500mm*1200mm,
Multilayer layers:508mm X 610mm (20" X 24")
Min line width/space 0.076mm / 0.0.076mm (0.003" / 0.003")
Via hole type Blind / Burried / Plugged(VOP,VIP…)
HDI / Microvia YES
Surface finish HASL
Lead Free HASL
Immersion Gold (ENIG), Immersion Tin, Immersion Silver
Organic Solderability Preservative (OSP) / ENTEK
Flash Gold(Hard Gold plating)
ENEPIG
Selective Gold Plating, Gold thickness up to 3um(120u")
Gold Finger, Carbon Print, Peelable S/M
Solder mask color Green, Blue, White, Black, Clear, etc.
Impedance Single trace,differential , coplanar impedance controlled ±10%
Outline finish type CNC Routing; V-Scoring / Cut; Punch
Tolerances Min Hole tolerance (NPTH)
Min Hole tolerance (PTH)
Min Pattern tolerance
±0.05mm
±0.075mm
±0.05mm