Rigid PCB

Item	Capability parameters
Layer count	1 ~ 64layers
Laminates type	FR-4(High Tg, Halogen Free, High Frequency) FR-5, CEM-3, PTFE, BT, Getek, Aluminium base，Copper base，KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon
Board thickness	6-240mil
Max Base copper weight	210um (6oz) for inner layer 210um (6oz) for outer layer
Min mechanical drill size	0.2mm (0.008")
Aspect ratio	12 : 1
Max panel size	Sigle side or double sides:500mm*1200mm, Multilayer layers:508mm X 610mm (20" X 24")
Min line width/space	0.076mm / 0.0.076mm (0.003" / 0.003")
Via hole type	Blind / Burried / Plugged(VOP,VIP…)
HDI / Microvia	YES
Surface finish	HASL Lead Free HASL Immersion Gold (ENIG), Immersion Tin, Immersion Silver Organic Solderability Preservative (OSP) / ENTEK Flash Gold(Hard Gold plating) ENEPIG Selective Gold Plating, Gold thickness up to 3um(120u") Gold Finger, Carbon Print, Peelable S/M
Solder mask color	Green, Blue, White, Black, Clear, etc.
Impedance	Single trace, differential, coplanar impedance controlled ±10%
Outline finish type	CNC Routing; V-Scoring / Cut; Punch
Tolerances	Min Hole tolerance (NPTH) Min Hole tolerance (PTH) Min Pattern tolerance	±0.05mm ±0.075mm ±0.05mm