Back Light Circuit Board Assembly

1, Support 0201 SMD chips, 0.4mm pitch BGA, QFN, POP, bonding
2, Inspection by SPI, AOI, X-Ray and other instruments
3, In 3~7 days to deliver PCBA samples for project acceleration
4, 100% function test of board before shipment to customer

PcbA industry application: Back lights

The process of pcb manufacturing process: SMT-DIP-packaging

Solder paste requirements: Thousands of live Ag3.0/Cu0.5/20-38uM

Welding method: manual welding, soldering iron temperature 370 degrees, penetrating tin 50%, confirmed by the business and the host LED number plug material.

Material name: chip resistor, led, patch IC, plug-in connector

Lamp beads: 9