Laser Equipment Mainboard Assembly

1, Support 0201 SMD chips, 0.4mm pitch BGA, QFN, POP, bonding
2, Inspection by SPI, AOI, X-Ray and other instruments
3, In 3~7 days to deliver PCBA samples for project acceleration
4, 100% function test of board before shipment to customer
Description

Producer application: Industrial Control(laser equipment)

Pcb specification: 4-layer, FR4, 1.6MM, copper thickness  35um, ENIG 2U", green SM

Smt points: 238
Dip points: 17

Solder paste requirements: Ag0.3/Cu0.7/20-38uм

Welding requirements:
1. The temperature of the soldering iron is controlled between 330 °C and 350 °C.
2. When soldering the connector, first position it, make sure the connector is not floating height and left and right oblique and then weld. (Rework connector has the risk of scrapping the board)