| Equipment | Quantity | Manufacturering Capability |
| SMT Lines | 4 | |
| DIP Lines | 7 | |
| Solder paste Printer machine | 4 | Max. Board Size: 410*360*4mm |
| Glue dispenser machine | 4 | |
| Chip mounter machine | 4 | 1)For chip components such as resistors, capacitors, etc.. Speed: 36,000CPH 2)0402 chips in MC (Capable 0201/01005 chips) |
| IC mounter machine | 4 | 1)For IC, BGA, etc.. Speed: 11,000CPH 2)Fine Pitch Component 0.5 mm (Capable 0.3 mm) 3)BGA 0.5mm pitch,256 Balls in MC (Capable 0.3 mm) |
| Reflow Soldering Machine | 4 | |
| AOI Machine | 4 | Desktop High speed Automated Optical Inspection machine. Inspection items: missing, shift, miss alignment, polarity, other component, bridge, dirt, dust, no solder, short solder, cold solder, lifted chip, lifted lead, un-insertion. OCR: optical character recognition/verification. After Printing Process: No solder paste, excess, blur, scratch, short, shift, bridge. |
| Axial Insertion Machine | 2 | |
| Radial Insertion Machine | 1 | |
| Wave Soldering Machine | 7 | |
| ICT machine | 7 | |
| Critical Quality Test | 3D Test Equipment X-RAY Test Equipment Environment Test Equipment( Including High Temperature & Humidity、Low Temperature & Humidity、Temperature & Humidity Cycle Test) ICT FCT Burn In Test |
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| Quality Standard | IPC-610D |
