Product Industry Application: Smoke Alarm
Production process: lead-free soldering process
Process flow: smt+dip+ brush three anti-paint + packaging
IQC furnace experiment: all self-purchased plastic molded patch materials have to be reflowed
Material baking requirements: Perform the operation according to the SMT Parts Baking Operation Guide. The 3G module of U6 number must be baked 100-125 degrees, 8 hours-12 hours
Solder paste requirements: Ag3.0/Cu0.5/20-38uM
Double-sided patch: SIM1 face stickers
Matters needing attention: 1. When the first side is produced, some components are red glue to prevent the second side from falling out of the furnace.
2. U6 bit number 3G module, must track whether it is false welding, offset, etc. is not stinky, if the bad ratio is greater than 3%, stop processing.
3.U1 bit number is attached to the heat sink after the machine components, pay attention to whether the good track is misaligned or not.
Dip welding method: hand soldering, soldering iron temperature 370 degrees, penetrating tin 50%; external port as far as possible to ensure horizontal and straight welding.