Smoke Alarm Pcb Assembly

1, Support 0201 SMD chips, 0.4mm pitch BGA, QFN, POP, bonding
2, Inspection by SPI, AOI, X-Ray and other instruments
3, In 3~7 days to deliver PCBA samples for project acceleration
4, 100% function test of board before shipment to customer

Product Industry Application: Smoke Alarm
Production process: lead-free soldering process

Process flow: smt+dip+ brush three anti-paint + packaging

IQC furnace experiment: all self-purchased plastic molded patch materials have to be reflowed

Material baking requirements: Perform the operation according to the SMT Parts Baking Operation Guide. The 3G module of U6 number must be baked 100-125 degrees, 8 hours-12 hours

Solder paste requirements: Ag3.0/Cu0.5/20-38uM

Double-sided patch: SIM1 face stickers

Matters needing attention: 1. When the first side is produced, some components are red glue to prevent the second side from falling out of the furnace.

2. U6 bit number 3G module, must track whether it is false welding, offset, etc. is not stinky, if the bad ratio is greater than 3%, stop processing.

3.U1 bit number is attached to the heat sink after the machine components, pay attention to whether the good track is misaligned or not.

Dip welding method: hand soldering, soldering iron temperature 370 degrees, penetrating tin 50%; external port as far as possible to ensure horizontal and straight welding.